Costumização: | Disponível |
---|---|
Materiais de Isolamento: | Resina de Epóxi |
Propriedades retardantes de chama: | V1 |
Fornecedores com licênças comerciais verificadas
Auditado por uma agência de inspeção terceirizada independente
Model Number | XT802-1 |
Type | smart electronics pcba |
Copper Thickness | 1oz,2oz |
Solder Mask | Green |
Silkscreen | White |
Electronic Test | Test-rig/Fly Probe Test |
Application | Electronics/Industrial Devices |
Material | FR4 /aluminum/ceramic CEM1 |
Board thickness | 1.6mm |
Min. Line Width | 0.1mm |
Surface Finishing | Hasl lead free |
Min. Hole Size | 0.2mm |
Min. Line Spacing | 0.1mm |
Process parameters | |
Number of layers of soft board | 1~8 |
Maximum processing area | 1900mm*250mm |
The thickness of the finished product of the processed plate | 0.036mm~2.4mm |
Wire copper foil thickness | 9μm~70μm (1/4oz~2oz) |
Minimum hole diameter | ≥4mil (0.1mm) |
Minimum line width/line spacing | 1.8mil/1.8mil(0.045mm/0.045mm) |
Surface treatment process | chemical immersion gold, OSP, electroless nickel gold plating, electroplating nickel gold plating |
Reinforcement fit tolerance ±0.2 | ±0.2 |
Shape tolerance: steel mold tolerance | ±0.1mm |
precision mold tolerance | ±0.05mm |
Impedance tolerance ±10% | ±10% |
Capacity | |
Single Layer | 3500 square meters/month |
Ordinary (impedance) double Layer | 14000 square meters/month |
3-4 layer soft board | 1500 square meters/month |
5-6 layer soft board | 1300 square meters/month |
7-8 layers soft board | 1000 square meters/month |
Sample delivery time | |
Single Layer | 2-3days |
Ordinary (impedance) double Layer | 3-4days |
3-4 layer soft board | 7-9days |
5-6 layer soft board | 9-12days |
7-8 layers soft board | 12-15days |
The first mass production delivery time | |
Single Layer | 6days |
Ordinary (impedance) double Layer | 7days |
3-4 layer soft board | 12days |
5-6 layer soft board | 14days |
7-8 layers soft board | 15days |