Descrição de Produto
Informações da Empresa
Descrição de Produto
Features
1. Adopt infrared weld technology which is developed independently.
2. Use infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcome disadvantage(burn out elements) of traditional welder machinery.
3. Easy operation. Just need one-day training, you can operation it skillfully.
4. Don´t need weld tools. IRDA Welder T870 can weld all the elements between 35x35-50*50mm.
5. This machine has 800W hot-melt system. Its preheating area is 240*180mm.
6. Infrared heating don´t have sirocco flow. Don´t impact circumjacent small elements. It is suitable for all of the elements. It can be used to unsolder BGA, SMD, CSP, LGA, QFP and PLCC, especially Micro BGA and SMD elements.
7. Definitely satisfy BGA unsoldering/repair of mobiles, computers, notebooks, the electronic game machinery and so on; Especially suits to the computer north and south bridge chip.
Technical parameters;
Work floor size: 360X240mm
Rated voltage and frequency: AC110v/AC220v 60/50Hz
Complete machine power: 1000W
Infrared heat lamp power: 150W
Preheating chassis power: 800W
Heating size of Infrared heat lamp: Φ70mm(50*50mm)
Preheating size of Preheating chassis: 240*180mm
Adjustable temperature of Infrared heat lamp: 200degree-350degree
Adjustable temperature o Preheating chassis: 60degree-200degree
1. Adopt infrared weld technology which is developed independently.
2. Use infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcome disadvantage(burn out elements) of traditional welder machinery.
3. Easy operation. Just need one-day training, you can operation it skillfully.
4. Don´t need weld tools. IRDA Welder T870 can weld all the elements between 35x35-50*50mm.
5. This machine has 800W hot-melt system. Its preheating area is 240*180mm.
6. Infrared heating don´t have sirocco flow. Don´t impact circumjacent small elements. It is suitable for all of the elements. It can be used to unsolder BGA, SMD, CSP, LGA, QFP and PLCC, especially Micro BGA and SMD elements.
7. Definitely satisfy BGA unsoldering/repair of mobiles, computers, notebooks, the electronic game machinery and so on; Especially suits to the computer north and south bridge chip.
Technical parameters;
Work floor size: 360X240mm
Rated voltage and frequency: AC110v/AC220v 60/50Hz
Complete machine power: 1000W
Infrared heat lamp power: 150W
Preheating chassis power: 800W
Heating size of Infrared heat lamp: Φ70mm(50*50mm)
Preheating size of Preheating chassis: 240*180mm
Adjustable temperature of Infrared heat lamp: 200degree-350degree
Adjustable temperature o Preheating chassis: 60degree-200degree
Endereço:
Room2007, Electric City, Guangzhou, Guangdong, China
Tipo de Negócio:
Fabricante / Fábrica, Empresa Comercial
Escala de Negócios:
Aparelhos Eletrônicos de Consumo, Elétrico & Eletrônico, Ferramentas & Hardware
Produtos Principais:
Leitor de cartões, auricular Bluetooth, pistolas de ar, mesa de soldadura
introdução da companhia:
Guangzhou link tecnologia eletrônica a empresa limitada é uma empresa profissional para manter o serviço no terminal móvel, que integra r e d, manufatrue e vendas. Estamos dedicados a fornecer uma série completa de produtos para o serviço de telemóvel para reparadores e ventoinhas móveis. Como, por exemplo, reparar livros técnicos, diagramas de documentação, instrumentos e ferramentas de assistência, etc.
Com o esforço de todo o pessoal, a ligação tornou-se uma das empresas mais eficazes do domínio dos serviços de telefonia móvel da China, bem como do sudeste da Ásia, do médio Oriente, da Europa e de África. 70% dos produtos de fora são exportados para o exterior.
Com o esforço de todo o pessoal, a ligação tornou-se uma das empresas mais eficazes do domínio dos serviços de telefonia móvel da China, bem como do sudeste da Ásia, do médio Oriente, da Europa e de África. 70% dos produtos de fora são exportados para o exterior.
